DP83869HMRGZT Integrated Circuit IC Chip High Immunity Ethernet Physical Layer

DP83869HMRGZT Integrated Circuit IC Chip

High Immunity 10 100 1000 Ethernet Physical Layer Transceiver Package 48-VQFN

Features
• Multiple operating modes
– Media support: copper and fiber
– Media conversion between copper and fiber
– Bridge between RGMII and SGMII
• Maximum ambient temperature available of 125°C
• Exceeds 8-kV IEC61000-4-2 ESD
• Low power consumption
– < 150 mW for 1000Base-X
– < 500 mW for 1000Base-T
• Low RGMII latency
– Total latency ≤ 384ns for 1000Base-T
– Total latency ≤ 361ns for 100Base-TX
• Time Sensitive Network (TSN) compliant
• Recovered clock output for SyncE
• Selectable synchronized clock output: 25 MHz and
125 MHz
• SFF-8431 V4.1, 1000BASE-X and 100BASE-FX
Compatible
• IEEE1588 support via SFD
• Wake on LAN support
• Configurable IO voltages: 1.8 V, 2.5 V, and 3.3 V
• SGMII, RGMII, MII MAC interface
• Jumbo frame support for 1000M and 100M speed
• Cable diagnostics
– TDR
– BIST
• Programmable RGMII termination impedance
• Integrated MDI termination resistor
• Fast link drop modes
• Conforms to IEEE 802.3 1000Base-T, 100BaseTX, 10Base-Te,1000Base-X, 100Base-FX

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DP83869HMRGZT Integrated Circuit IC Chip

DP83869HMRGZT

DP83869HMRGZT Integrated Circuit IC Chip High Immunity Ethernet Physical Layer Images